The Nordpac Conference is proud to announce exciting and informative Keynote addresses in the planary seesions during the conference:
Interconnection technology for next generation wearable and power electronics, Prof Katsuaki Suganuma, Osaka University
|Professor Suganuma received the degree of Dr. Engineer from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center in 2007-2009 and the deputy director of ISIR in 2010-2012. He has worked on lead-free soldering, conductive adhesive, power electronics packaging and printed electronics. He published several books in these fields. He is currently in charge of the several projects such as Printed electronics standardization IEC TC119 Japan committee (JEITA), Chairmans of Printed Electronics Association of Japan and WGB systemintegration consortium|
Co-Design/Modelling and Simulation for Advanced Packaging
Professor Bailey is Director of the Computational Mechanics and Reliability Group at the University of Greenwich, UK. He obtained is PhD in multi-physics modelling in 1988, and an MBA in Technology Management in 1996. He has published over 300 papers on design, modelling, and simulation of electronics packaging technologies. He is a member of the Board of Governors for IEEE CPMT, Vice President for CPMT conferences, and is UK Chapter Chair for the IEEE CPMT and Reliability Societies. He is also a member of the technical working group on the new Heterogeneous Integration Roadmap leading the efforts on modelling and simulation.
3D based fingerprint sensors, Pontus Jägemalm, Fingerprint cards
Thermal management in Electronics, Arvind Sridhar, IBM
(Title to be decided), Kristina Gold, Ericsson