IMAPS Nordic 2017
Nordic Conference on Microelectronics Packaging, NordPac
in technical co-sponsorship with IEEE CPMT
18th – 20th June 2017, Läppstiftet Conference Center, Gothenburg, Sweden
CALL FOR PAPERS
Registration is open! Download the registration form here (Excel file).
It is our pleasure to announce that the IMAPS Nordic Conference on Microelectronics Packaging (NordPac) will be held 18th – 20th June 2017 in Gothenburg, Sweden. This is first time that IMAPS Nordic Chapter and IEEE CPMT Nordic Chapter jointly organise this event. The event brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!
In addition to representations from the Nordic countries, the conference attracts much wider audience, from multiple other world regions, making it a truly international event.
CALL FOR PAPERS
NordPac 2017 seeks original papers describing research and development in all areas of microelectronics components, packaging, system integration and manufacturing technologies. You are invited to submit abstracts that provide non-commercial information of new developments and knowledge in the areas including, but not limited to each technical track:
|Materials and Processes for Packaging||Advanced Packaging and System Integration|
|Interconnect Technology||Thermal Management|
|1D, 2D, 2.5D and 3D integration technology||Signal Integrity|
|Emerging Technology||Reliability, Material and Process Modelling|
|Reliability Testing and Characterization||Design for Recycling in Electronics Packaging|
|Applications||Life Cycle Assessment|
PUBLICATION OF PAPERS
All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library (www.ieeexplore.ieee.org) after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.
BEST STUDENT PAPER AWARD
PROFESSIONAL DEVELOPMENT SHORT COURSES
NordPac 2017 STEERING COMMITTEE chair: Paul Collander, Poltronic Ltd, Finland
NordPac 2017 TECHNICAL COMMITTEE chair: Johan Liu, Chalmers University of Technology, Sweden
NordPac 2017 LOCAL ORGANISING COMMITTEE chair: Yifeng Fu, Chalmers University of Technology, Sweden
NordPac 2017 Student ORGANIZING COMMITTEE chair: Andreas Nylander, Chalmers University of Technology, Sweden
|Abstract submission deadline:||28th March 2017|
|Professional development short course proposal:||18th March 2017|
|Notification of abstract acceptance:||15th April 2017|
|Deadline for full paper submission:||15th May 2017|