IMAPS Nordic

Conference 2017

The IMAPS Nordic 2017 

Nordic Conference on Microelectronics Packaging, NordPac

in technical co-sponsorship with IEEE CPMT 

was held on

18th – 20th June 2017 at Läppstiftet Conference Center, Gothenburg, Sweden


IMAPS Nordic and IEEE CPMT would like to thank the orgnanising committee in the successful organisation of the 2017 NordPac Conference!

The NordPac 2017 conference had over 80 participants contributing to a lively and friendly conference with five keynote speakers and 13 exhibitors. The proceedings from the conference can be found at IEEE here.

Keynote speakers

Prof Katsuaki Suganuma

Osaka University

 Kristina Gold,


 Bill Bottoms

Third Millennium Test Solutions Inc.

Arvind Sridhar


Pontus Jägemalm

Fingerprint cards  

Interconnection technology for next generation wearable and power electronics  Trends shaping innovation in the ICT industry  Roadmapping Heterogeneous Integration – A key to our future,  Ultimately Dense and Efficient Future Computers    3D based fingerprint sensors

Short courses

As a part of the conference, two short courses were orgenised on relevant topics.

Dr. Rajan Ambat 

Technical Univerity of Denmark

Torbjörn Nilsson


 Dr. Yifeng Fu

Chalmers Univerity

Humidity related failure issues in electronics Thermal management in electronics.


Exhibitors and sponsors



Best Student Paper Award

The Best Paper Student Award was given to Selin Tolunay Wipf from IHP Microelectronics for her paper titled "Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance".