IMAPS Nordic

NordPac 2019



The Nordic Conference on Microelectronics Packaging, NordPac 2019

will be held

11th – 13th June 2019 at the Technical University of Denmark, Lyngby, Denmark


Jointly arranged by IMAPS Nordic and IEEE EPS Nordic


We are proud to announce that the 2019 NordPac conference will be held in Denmark. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at VTT Technical Research Centre of Finland Ltd in Oulu. The IMAPS Nordic conference was here in 2014. 

Abstract Submission will open soon and will be done via our conference portal. Please see the Abstract Guidelines page for help. 

Full paper submission will aslo be done via our conference portal. Please provide three files:

  • Your paper in MS Word format 
  • Your paper in pdf format, with all fonts embedded 
  • A signed and scanned pdf of the copyright agreement.  

All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library ( after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.

The paper should be 4 - 10 pages. Please download either the MS Word Template (.doc file) or the Latex-template (.zip file).

For students we have the possibility to have papers classified as Reviewed and published in both IEEE Xplore and IMAPS North America IMAPSource, see and

The deadline for the final paper is May 22, but if you want your paper to be reviewed deadline is May 1st. Late papers are not published.

VISA information

If you require a VISA to enter Denmark, you may need an Invitation Letter. Please contact the organising commitee on This email address is being protected from spambots. You need JavaScript enabled to view it. to receive your letter. An invitation letter can only be issued to speakers.

As part of the annual IMAPS Nordic conference, PhD and Master Students are especially encouraged to submit an abstract. For this we have set up a Review process for those who need reviewed and published papers. This is a great opportunity to interact with the industrial and academic community at an international level (coming from inside and outside the Nordic countries).

Printed, flexible electronics

Medical electronics

Unique materials, PTF and ACF


High temperature electronics, harsh environment

Sensor integration & applications

3D Advanced interconnect, advanced packaging

Wearable electronics

Ceramics: thick film, copper plated, DBC, LTCC

Reliability assessments, SPC and FMEA





We will have an industrial exhibition along with the technical sessions.  If you are interested, please contact: Dr. Daniel Nilsen Wright, at This email address is being protected from spambots. You need JavaScript enabled to view it.. See the Exhibition page for details.